RF-power-controlled young's modulus of plasma-polymerized organosilicon films

Journal of Materials Science

Volumn 40, Issue 18, 2005, Pages 5099-5102

  Cech, V ^a   Vanek, J ^a   Goruppa, A A ^b   Jones, F R ^b  

^a BRNO UNIVERSITY OF TECHNOLOGY   (Czech Republic)

^b UNIVERSITY OF SHEFFIELD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; COMPRESSIVE STRENGTH; CROSSLINKING; PLASMA POLYMERIZATION; STRAIN; THIN FILMS;

ELASTIC STRAIN; FILM PACKING DENSITY; ION ENERGY; ORGANOSILICON FILMS;

ELASTIC MODULI;

EID: 25444489831     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-1672-x     Document Type: Article

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