Pastes for electromagnetic interference shielding

Journal of Electronic Materials

Volumn 34, Issue 9, 2005, Pages 1255-1258

  Wu, Junhua ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Carbon; Electromagnetic; Electromagnetic interference (EMI); Graphite; Shielding; Steel

Indexed keywords

ACOUSTIC WAVE REFLECTION; ADHESIVE PASTES; BINDERS; CARBON; COATING TECHNIQUES; DRYING; FIBERS; GRAPHITE; STAINLESS STEEL; WAVE INTERFERENCE;

ELECTROMAGNETIC INTERFERENCE (EMI); GRAPHITE FLAKES; GRAPHITE-COLLOIDS; STAINLESS STEEL FIBERS;

ELECTROMAGNETIC SHIELDING;

EID: 25444442117     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0271-6     Document Type: Article

References (32)

1. D. Bjorklof, Compliance Eng. 15, 10 (1998).
2. R. Brewer and G. Fenical, Shielding: Eval. Eng. 37, S-4 (1998).
3. P. O'Shea, Eval. Eng. 37, 40 (1998).
4. R.S.R. Devender, Proc. Int. Conf. Electromagnetic Interference and Compatability (Piscataway, NJ: IEEE, 1997), pp. 459-466.
5. B. Geddes, Control 9, 4 p. (1996).
6. S. Hempelmann, Galvanotechnik 88, 418 (1997).
7. W.D. Kimmel and D.D. Gerke, Med. Dev. Diagnostic Industry 17, 112 (1995).
8. H.W. Markstein, Electron. Packaging Prod. 35, 4 (1995).
9. K.A. McRae, Nat. Conf. Pub.-Institution of Engineers, Australian (Crows Nest, NSW, Australia: IE Aust, 1994), vol. 2 (94/11), pp. 495-498.
10. V.V. Sadchikov and Z.G. Prudnikova, Stal' 4, 66 (1997).
11. S. Shinagawa, Y. Kumagai, and K. Urabe, J. Porous Mater. 6, 185 (1999).
12. J. Mao, J. Chen, M. Tu, W. Huang, and Y. Liu, Gongneng Cailiao / J. Funct. Mater. 28, 137 (1997).
13. J. Mao, J. Chen, M. Tu, W. Huang, and Y. Liu, Gongneng Cailiao / J. Funct. Mater. 28, 626 (1997).
14. D.D.L. Chung, Carbon 39, 279 (2001).
15. A. Kaynak, A. Polat, and U. Yilmazer, Mater. Res. Bull. 31, 1195 (1996).
16. X. Fu and D.D.L. Chung, Carbon 36, 459 (1998).
17. X. Luo and D.D.L. Chung, Composites B 30, 227 (1999).
18. X. Shui and D.D.L. Chung, J. Electron. Packaging 119, 236 (1997).
19. P.B. Jana and A.K. Mallick, J. Elastomers Plastics 31, 1195 (1996).
20. X. Shui and D.D.L. Chung, J. Electron. Mater. 26, 107 (1995).
21. J.-M. Chiou, Q. Zheng, and D.D.L. Chung, Composites 20, 379 (1989).
22. X. Shui and D.D.L. Chung, J. Electron. Mater. 24, 107 (1995).
23. Y. Ramadin, S.A. Jawad, S.M. Musameh, M. Ahmad, A.M. Zihlif, A. Paesano, E. Martuscelli, and G. Ragosta, Polymer Int. 34, 145 (1994).
24. J.C. Roberts and P.D. Weinhold, J. Composite Mater. 29, 1834 (1995).
25. L.G. Morin, Jr. and R.E. Duvall, Proc. 43rd Int. SAMPE Symp. Exhib. (Covina, CA: SAMPE, 1998), vol. 43, pp. 874-881.
26. J.R. Gaier and J. Terry, 7th Int. SAMPE Electronics Conf. (Covina, CA: SAMPE, 1994) vol. 7, pp. 221-233.
27. X. Luo and D.D.L. Chung, Carbon 34, 1293 (1996).
28. www.achesonindustries.com
29. J. Cao and D.D.L. Chung, Cem. Concr. Res. 33, 1737 (2003)
30. J. Wu and D.D.L. Chung, Carbon 41, 1313 (2003).
31. S. Wen and D.D.L. Chung, Cem. Concr. Res. 34, 329 (2004).
32. X. Shui and D.D.L. Chung, J. Mater. Sci. 35, 1773 (2000).