Adhesion mechanisms in the solid-state bonding technique using submicrometer aromatic thermosetting copolyester adhesive

Journal of Applied Polymer Science

Volumn 92, Issue 6, 2004, Pages 3843-3856

  Xu, Kun ^a,b   Selby, John C ^a   Shannon, Mark A ^a   Economy, James ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b NONE   (United States)

Author keywords

Adhesion; Aromatic thermoset; Polyimide; Solid state bonding; Thin films

Indexed keywords

ADHESION; AROMATIC POLYMERS; ELECTRONICS PACKAGING; MICROELECTRONICS; PLASTIC ADHESIVES; PLASTIC COATINGS; POLYIMIDES; THERMOSETS; THIN FILMS;

MICROELECTRONIC PACKAGING; SOLID-STATE BONDING;

POLYESTERS;

POLYMER SCIENCE;

EID: 2542456533     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.20403     Document Type: Article

References (25)

1. Brown, H. R.; Yang, A. C. M.; Russell, T. P.; Volksen, W.; Kramer, E. J. Polymer 1988, 29, 1807.
2. Mittal, K. L. Polyamides: Synthesis, Characterization, and Applications 1-2; Plenum Press: New York, 1984.
3. Nese, M.; Hannerborg, A. Sens Actuat A 1993, 37-38, 61.
4. Stoffel, N. C.; Dai, C.-A.; Kramer, E. J.; Russell, T. P.; Deline, V.; Volksen, W.; Wu, W.; Satija, S. Macromolecules 1996, 29, 6880.
5. Stoffel, N. C.; Kramer, E. J.; Volksen, W.; Russell, T. P. Polymer 1993, 34, 4524.
6. Jones, R. A. L.; Norton, L. J.; Kramer, E. J.; Bates, F. S.; Wiltzius, P. Phys Rev Lett 1991, 66 (10), 1326.
7. Furman, B. K.; Childs, K. D.; Clearfield, H.; Davis, R.; Purushothaman, S. J Vacuum Sci Technol A 1992, 4, 2913.
8. Stoffel, N. C.; Hsieh, M.; Kramer, E. J.; Volksen, W. IEEE Trans Compon Packag Manuf Technol B 1996, 19, 417.
9. Maas, D.; Bustgens, B.; Fahrenberg, J.; Keller, W.; Seidel, D. 4th International Conference on New Actuators; Bremen, Germany, 1994; pp 75-78.
10. Mass, D.; Bustgens, K.; Fahrenberg, J.; Keller, W.; Ruther, P.; Schomburg, W. K.; Seidel, D. Proceedings of the 1996 IEEE Micro Electro Mechanical Systems Workshop, San Diego, CA, 1996; pp 331-336.
11. Lee, K.-W.; Viehbeck, A.; Walker, G. F.; Cohen, S.; Zucco, P.; Chen, R.; Ree, M. J Adhes Sci Technol 1996, 10, 807.
12. Frich, D.; Economy, J.; Goranov, K. Polym Eng Sci 1997, 37, 541.
13. Xu, K.; Economy, J.; Shannon, M. A. Int J Microcircuits Electron Packag 2000, 23, 78.
14. Selby, J. C.; Shannon, M. A.; Xu, K.; Economy, J. Micromech Microeng 2001, 11, 672.
15. Shannon, M.; Philpott, M.; Miller, N.; Bullard, C.; Beebe, D.; Jacobi, A.; Hrnjak, P.; Saif, T.; Aluru, N.; Sehitoglu, H. Rocket, A.; Economy, J. Proc ASME, Adv Energy Sys Div 1997, 75.
16. Niessner, N.; Muehlebach, A.; Lyerla, J. R.; Facey, G. A.; Fyfe, C. A. Makromol Chem 1993, 194, 649.
17. Xu, K. Ph.D. Thesis, University of Illinois at Urbana-Champaign, 2002.
18. Frich, D.; Hall, A.; Economy, J. Macromol Chem Phys 1998, 199, 913.
19. Frich, D.; Goranov, K.; Schneggenburger, L.; Economy, J. Macromolecules 1996, 29, 7734.
20. Selby, J. C. Master Thesis, University of Illinois at Urbana-Champaign, 2001.
21. Jung, D. R.; Czanderna, A. W. Crit Rev Solid State Mater Sci 1994, 19, 1.
22. Wu, S. Polymer Interface and Adhesion, 1st ed.; Marcel Dekker: New York, 1982.
23. Wilson, R. G.; Stevie, F. A.; Magee, C. W., Eds. Secondary Ion Mass Spectrometry: A Practical Handbook for Depth Profiling and Bulk Impurity Analysis; Wiley: New York, 1989.
24. Brown, H. R.; Yang, A. C. M. J Adhes Sci Technol 1992, 6, 333.
25. Lee, K.-W. J Adhes Sci Technol 1994, 8, 1077.