Fabrication and characterization of polymer/nanoclay hybrid ultrathin multilayer film by spin self-assembly method

Thin Solid Films

Volumn 458, Issue 1-2, 2004, Pages 9-14

  Lee, Ho Chul ^a   Lee, Tae Woo ^b,c   Kim, Tae Ho ^b   Park, O Ok ^b  

^a Samsung Corning Co Ltd   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c LUCENT TECHNOLOGIES   (United States)

Author keywords

Layered silicate; Light emitting diode; Poly (p phenylene vinylene); Spin self assembly; Ultrathin multilayer film

Indexed keywords

LIGHT EMITTING DIODES; OPTICAL COATINGS; OPTOELECTRONIC DEVICES; PHOTOLUMINESCENCE; PLASTIC FILMS; POLYELECTROLYTES; SELF ASSEMBLY;

BRAGG PEAKS; KIESSIG FRINGES; LAYERED SILICATE; POLY (P-PHENYLENE VINYLENE); X-RAY REFLECTIVITY (XRR);

ULTRATHIN FILMS;

EID: 2542445681     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2003.11.117     Document Type: Article

References (28)

1. Lvov Y., Yamada S., Kunitake T. Thin Solid Films. 300:1997;107.
2. Saremi F., Lang G., Tieke B. Adv. Mater. 8:1996;923.
3. Cho J., Char K., Kim S.Y., Hong J.D., Lee S.K., Kim D.Y. Thin Solid Films. 379:2000;188.
4. Lee S., Kang Y., Lee C. Synth. Met. 117:2001;257.
5. Neumann R., Davidov D. Acta Polym. 49:1998;642.
6. Hong H., Tarabia M., Chayet H., Davidov D., Faraggi E.Z., Avny Y., Neumann R., Kirstein S.J. J. Appl. Phys. 79:1996;3082.
7. Hong J.D., Kim D., Cha K., Jin J.I. Synth. Met. 84:1997;815.
8. Kim Y.H., Wurm D.B., Kim M.W., Kim Y.T. Thin Solid Films. 352:1999;138.
9. Kim Y., Lee E., Jung D.Y. Chem. Mater. 13:2001;2684.
10. Wang L.H., Wang W., Zhang W.G., Kang E.T., Huang W. Chem. Mater. 12:2000;2212.
11. Clays K., Armstrong N.J., Ezenyilimba M.C., Penner T.L. Chem.Mater. 5:1993;1032.
12. Decher G., Lvov Y., Schmidt J. Thin Solid Films. 244:1994;772.
13. Decher G., Hong J., Schmitt J. Thin Solid Films. 210:1992;831.
14. Lvov Y., Decher G., Mohwald H. Langmuir. 9:1993;481.
15. Lvov Y., Haas H., Decher G., Mohwald H., Kalachev A. J. Phys. Chem. 97:1993;12835.
16. Kleinfeld E.R., Ferguson G.S. Science. 265:1994;370.
17. Kotov N.A., Haraszti T., Turi L., Zavala G., Geer R.E., Dekany I., Fendler J.H. J. Am. Chem. Soc. 119:1997;6821.
18. Kim D.W., Blumstein A., Kumar J., Tripathy S.K. Chem. Mater. 13:2001;243.
19. Kim D.W., Blumstein A., Tripathy S.K. Chem. Mater. 13:2001;1916.
20. Cho J., Char K., Hong J.D., Lee K.B. Adv. Mater. 13:2001;1076.
21. Lee S.S., Hong J.D., Kim C.H., Kim K., Koo J.P., Lee K.B. Macromolecules. 34:2001;5358.
22. Chiarelli P.A., Johal M.S., Casson J.L., Roberts J.B., Robbson J.M., Wang H.L. Adv. Mater. 13:2001;1167.
23. Lee H.C., Lee T.W., Lim Y.T., Park O.O. Appl. Clay Sci. 21:2002;287.
24. Lee T.W., Park O.O., Kim J.J., Hong J.M., Kim Y.C. Chem. Mater. 13:2001;2217.
25. Lee T.W., Park O.O., Yoon J., Kim J.J. Adv. Mater. 13:2001;211.
26. Baur J.W., Rubner M.F., Reynolds J.R., Kim S. Langmuir. 15:1999;6460.
27. Wang H.L., McBranch D.W., Klimov V.I., Helgeson R., Wudl F. Chem. Phys. Lett. 315:1999;173.
28. Tarabia M., Hong H., Davidov D., Kirstein S., Steitz R., Neumann R., Avny Y. J. Appl. Phys. 83:1998;725.