Nitrogen plasma modification on polyimide films for copper metallization on microelectronic flex substrates

Journal of Polymer Science, Part B: Polymer Physics

Volumn 43, Issue 15, 2005, Pages 2023-2038

  Lin, Yung Sen ^a   Liu, Huang Ming ^a   Tsai, Chung Wei ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Adhesion; AFM; ESCA; Nitrogen plasma; Surface modification

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CHEMICAL ANALYSIS; CHEMICAL BONDS; ELECTRON SPECTROSCOPY; METALLIZING; PLASMAS; POLYIMIDES; SURFACE TREATMENT;

ADHESION STRENGTH; ELECTRON SPECTROSCOPY FOR CHEMICAL ANALYSIS (ESCA); NITROGEN PLASMA; POLYIMIDE FILMS;

PLASTIC FILMS;

EID: 25144522843     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/polb.20497     Document Type: Article

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