Analysis of envelope signal injection for improvement of RF amplifier intermodulation distortion

IEEE Journal of Solid-State Circuits

Volumn 40, Issue 9, 2005, Pages 1888-1894

  Leung, Vincent W ^a,b   Deng, Junxiong ^a   Gudem, Prasad S ^a   Larson, Lawrence E ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b IBM RESEARCH   (United States)

Author keywords

Adaptive bias; BiCMOS integrated circuits; Envelope injection; Intermodulation distortion; RF amplifier; SiGe; Spectral regrowth; Volterra series; Wideband code division multiple access (WCDMA)

Indexed keywords

AMPLIFIERS (ELECTRONIC); CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; INTERMODULATION; SILICON COMPOUNDS;

ADAPTIVE BIAS; BICMOS INTEGRATED CIRCUITS; ENVELOPE INJECTION; INTERMODULATION DISTORTION (IMD); RF AMPLIFIER; SIGE; SPECTRAL GROWTH; VOLTERRA SERIES; WIDEBAND CODE DIVISION MULTIPLE ACCESS (WCDMA);

SIGNAL PROCESSING;

EID: 25144455910     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2005.848176     Document Type: Conference Paper

References (10)

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