The effect of catalyst density for adhesion of electroless deposited copper films on glass substrate

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 69, Issue 7, 2005, Pages 502-508

  Okamoto, Naoki ^a   Kimura, Takashi ^b   Watanabe, Tohru ^a  

^a TOKYO METROPOLITAN UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

Adhesion; Copper; Electrolessdeposition; Glass

Indexed keywords

ADHESIVE STRENGTHS; CATALYST DENSITY; ELECTROLESSDEPOSITION; GLASS SUBSTRATES;

ACTIVATION ANALYSIS; ADHESION; CATALYSIS; CONCENTRATION (PROCESS); ELECTRODEPOSITION; METALLIC GLASS; PALLADIUM; TIN; X RAY PHOTOELECTRON SPECTROSCOPY;

THIN FILMS;

EID: 24944486302     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.69.502     Document Type: Article

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