The Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 68, Issue 2, 2004, Pages 110-113

  Okamoto, Naoki ^a   Watanabe, Tohru ^a  

^a TOKYO METROPOLITAN UNIVERSITY   (Japan)

Author keywords

Adhesion; Copper; Electrodeposition; Nickel; Silver

Indexed keywords

ADHESION; COPPER; CRYSTALLOGRAPHY; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); METALLIC FILMS; MICROSTRUCTURE; NICKEL; SCANNING ELECTRON MICROSCOPY; SILVER; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRODEPOSITED FILMS; INTERFACE MICROSTRUCTURES;

ELECTRODEPOSITION;

EID: 1942540068     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.68.110     Document Type: Article

References (5)

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