Overlay measurement accuracy verification using CD-SEM and application to the quantification of WIS caused by BARC

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5752, Issue III, 2005, Pages 1413-1423

  Lecarpentier, Laurent ^a   Vachellerie, Vincent ^a   Kassel, Elyakim ^c   Avrahamov, Yosef ^c   Huang, Chin Chou K ^c   Felten, Frank ^c   Polli, Marco ^c   Feneyrou, Aurélien ^a   Thony, Philippe ^b   Guillot, Stéphane ^a  

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

^c KLA TENCOR CORPORATION   (United States)

Author keywords

Overlay Accuracy; Overlay Metrology Error; Wafer Induced Shift

Indexed keywords

DIMENSIONAL STABILITY; ERROR ANALYSIS; ETCHING; MEASUREMENTS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR MATERIALS;

OVERLAY ACCURACY; OVERLAY METROLOGY ERROR; PREDICTION ERROR ANALYSIS; WAFER-INDUCED-SHIFT;

OPTICAL VARIABLES MEASUREMENT;

EID: 24644521529     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.610662     Document Type: Conference Paper

References (2)

1. Mike Adel, Mark Ghinovker, Jorge Poplawski, Elyakim Kassel, Pavel Izikson, Ivan Pollentier, Philippe Leray, David Laidler - Characterization of Overlay Mark Fidelity - Metrology, Inspection and Process Control for Microlithography XVII, Proceedings of SPIE Vol. 5038 (2003), p.437.
2. M. Adel, J.A. Allgair, D.C. Benoit, M. Ghinovker, E. Kassel, C. Nelson, J.C. Robinson, G.S. Seligman - Performance Study of New Segmented Overlay Marks for Advanced Wafer Processing - Metrology, Inspection and Process Control for Microlithography XVII, Proceedings of SPIE Vol. 5038 (2003), p.453.