Comparative study on effectiveness of on-chip, on-package and PCB decoupling for core noise reduction by using broadband power delivery network models

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 732-739

  Mandhana, Om P ^a   Zhao, Jin ^b  

^a Networking and Computer Systems Group   (United States)

^b Sigrity Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY RANGE; GROUND NOISE; MICROPROCESSOR SYSTEMS;

CAPACITORS; ELECTRIC IMPEDANCE; FREQUENCIES; OPTIMIZATION; PRINTED CIRCUIT BOARDS;

MICROPROCESSOR CHIPS;

EID: 24644496290     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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3. PowerSI by SIGRITY, Inc.
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5. Gustavsen, B., and Semlyn, A., "Rational Approximation of Frequency Domain Responses by Vector Fitting", IEEE Trans. Power Delivery, pp. 1052-1061, vol. 14, no.3, July 1999
6. Antonini, G., "SPICE Equivalent Circuits of Frequency-Domain Responses", IEEE Trans. Electromagnetic Compatibility, pp. 502-512, vol. 45., no.3, August 2003
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8. SPEED2000 by SIGRITY, Inc.