Surface characterization of a low dielectric constant polymer-SiLK* polymer, and investigation of its interface with Cu

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 5, 1999, Pages 2336-2340

  Pireaux, J J ^a  

^a UNIVERSITY OF NAMUR   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 24644475857     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. "Copper mettalization in industry," MRS Bull. 19(8) (1994).
2. IBM Res. Mag. 4 (1997). http://www.research.ibm.com/resources/magazine/1997/issue_4/copper497.html
3. L. Peters, Semicond. Int. 64 (1998);
4. P. H. Townsend et al., Mater. Res. Soc. Symp. Proc. 476, 9 (1997).