Dynamic analysis of flip-chip self-alignment

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 3, 2005, Pages 475-480

  Lu, Hua ^a   Bailey, Christopher ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Computer modeling; Coupled dynamic analysis; Flip chip; Self alignment

Indexed keywords

CALCULATIONS; COMPUTER SIMULATION; DYNAMICS; FLIP CHIP DEVICES; MATHEMATICAL MODELS; OPTOELECTRONIC DEVICES; SOLDERING; SUBSTRATES;

ALIGNMENT DYNAMICS; BALL GRID ARRAYS (BGA); COUPLED DYNAMIC ANALYSIS; FLIP-CHIP SELF-ALIGNMENT;

CHIP SCALE PACKAGES;

EID: 24644453138     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.848371     Document Type: Article

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