Development of environmentally preferred plastic ball grid array, PBGA, components

Proceedings - 2nd International Symposium on Environmentally Conscious Design and Inverse Manufacturing

Volumn , Issue , 2001, Pages 946-951

  Matsuda, Y ^a   Woosley, A ^b   Koschmieder, Thomas ^b   Teh, G K ^c   Ibrahim, Ruzaini ^c  

^a Motorola Japan   (Japan)

^b MOTOROLA INC   (United States)

^c Motorola Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; HALOGENATION; LEAD; LEAD-FREE SOLDERS; MANUFACTURE; MECHANICAL VARIABLES MEASUREMENT; SOLDERING ALLOYS;

BOARD-LEVEL RELIABILITY; CIRCUIT BOARDS; CROSS-FUNCTIONAL TEAMS; HALOGEN-FREE; HALOGENATED COMPOUNDS; MATERIALS AND PROCESS; PB SOLDERS; PLASTIC BALL GRID ARRAYS;

ELECTRONICS PACKAGING;

EID: 84963642478     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECODIM.2001.992499     Document Type: Conference Paper

References (4)

1. WEEE (Waste from Electrical and Electronic Equipment, official title - "Proposal for a European Parliament and Council directive on waste electrical and electronic equipment (COM(2000) 347 - C5-0414/2000 - 2000/6158(COD)
2. ROHS (Restrictions on Hazardous Substances, official title "Proposal for a European Parliament and Council directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment Devices, April 1999. (COM(2000) 347 - C5-0415/2000 - 2000/0159(COD)
3. "Development and Characterization Of Pb and Halogen FreeIC Packages to meet the requirements of Assembly of MSL 3 at 260C Peak reflow temperature", Joint Internatonal Congress - Electronics Goes Green 2000+, September 11, 2000, Woosley, Et al.
4. IPC JEDEC J-STD-020A, Moisture Reflow Sensitivity Classification for Non Hermetic Solid State Surface Mount