Via-hole etching for SiC

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 5, 1999, Pages 2050-2054

  Pearton, S J ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 24644441858     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. F. Lanois, D. Planson, M. L. Locatelli, P. Lassagne, C. Jaussaud, and J. P. Chante, J. Electron. Mater. 28, 219 (1999).
2. P. H. Yih and A. J. Steckl, J. Electrochem. Soc. 140, 1813 (1993).