High capacitance density thin film integrated tantalum pentoxide decoupling capacitors

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 779-782

  Thomason, Chris ^a   Schaper, Len ^a   Morgan, Julie ^a   Burkett, Susan ^a   Ulrich, Richard ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE DENSITY; CAPACITOR DESIGN; HIGH CURRENTS;

CAPACITANCE; ELECTRIC POWER SYSTEMS; SUBSTRATES; SWITCHING; TANTALUM COMPOUNDS; THIN FILMS;

CAPACITORS;

EID: 24644440148     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. th Electronic Components and Technology Conf, Orlando, FL, May. 1996, pp. 358-364.
2. th Electronic Components and Technology Conf, Las Vegas, NV, May. 2004, pp. 266-270.
3. Mannath, D., A. Yadav, L. Schaper, R. Ulrich, "Yield and Reliability of Tantalum Pentoxide Integrable Decoupling Capacitors," IMAPS 2004.
4. Ulrich, R. K, and L. W. Schaper, Integrated Passive Component Technology, John Wiley & Sons Inc (2003).
5. th Electronic Components and Technology Conf, San Jose, CA, May. 1997, pp. 724-729.
6. Ulrich, R, Schaper, L. "Decoupling with Surface Mount Capacitors", CircuiTree, June 2003, Vol. 16, no. 6, p. 22.