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Volumn 1, Issue , 2004, Pages 266-270
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Advanced decoupling in high performance IC packaging
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Author keywords
[No Author keywords available]
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Indexed keywords
CAPACITANCE DENSITY;
CONDUCTIVE EPOXY CONNECTION;
PARASITIC INDUCTANCE;
CAPACITANCE;
CAPACITORS;
ELECTRIC RESISTANCE;
INDUCTANCE;
INTEGRATED CIRCUITS;
NICKEL;
PLASTIC FILMS;
TANTALUM COMPOUNDS;
ELECTRONICS PACKAGING;
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EID: 10444277265
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (11)
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References (4)
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