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Volumn 1, Issue , 2004, Pages 266-270

Advanced decoupling in high performance IC packaging

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE DENSITY; CONDUCTIVE EPOXY CONNECTION; PARASITIC INDUCTANCE;

EID: 10444277265     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (11)

References (4)
  • 1
    • 4544294930 scopus 로고    scopus 로고
    • Decoupling with surface mount capacitors
    • June
    • R. Ulrich, L. Schaper, "Decoupling with Surface Mount Capacitors", CircuiTree, June 2003, Vol 16, no. 6, p. 22.
    • (2003) CircuiTree , vol.16 , Issue.6 , pp. 22
    • Ulrich, R.1    Schaper, L.2
  • 3
    • 10444272057 scopus 로고    scopus 로고
    • Integrated decoupling in highperformance IC packaging
    • Palo Alto CA, October 19-22
    • Schaper, L. W., and R. K. Ulrich, "Integrated Decoupling in HighPerformance IC Packaging," IMAPS ATW on System Packaging, Palo Alto CA, October 19-22, 2003.
    • (2003) IMAPS ATW on System Packaging
    • Schaper, L.W.1    Ulrich, R.K.2
  • 4
    • 10444229918 scopus 로고    scopus 로고
    • Decoupling with integrated capacitors
    • Minneapolis, September 30
    • Ulrich, R. K., and L. W. Schaper, Decoupling with Integrated Capacitors, IPC Fall Meeting, Minneapolis, September 30, 2003.
    • (2003) IPC Fall Meeting
    • Ulrich, R.K.1    Schaper, L.W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.