Effects of the low loss polymers on the dielectric behavior of novel aluminum-filled high-K nano-composites

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 158-170

  Xu, Jianwen ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISSIPATION FACTORS; EMBEDDED PASSIVES; KERNER MODELS;

ALUMINUM COMPOUNDS; ANODIC OXIDATION; CHEMICAL VAPOR DEPOSITION; COMPOSITE MATERIALS; COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; EMBEDDED SYSTEMS; FILLERS; PASSIVATION; PERMITTIVITY; POLYMERS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

NANOSTRUCTURED MATERIALS;

EID: 2442646848     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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