Temperature dependence of the grain boundary segregation of Bi in Cu polycrystals

Scripta Materialia

Volumn 37, Issue 6, 1997, Pages 729-735

  Chang, L S ^a   Rabkin, E ^a   Straumal, B ^a   Lejcek P ^b   Hofmann, S ^c   Gust, W ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b INSTITUTE OF PHYSICS   (Czech Republic)

^c NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; AUGER ELECTRON SPECTROSCOPY; BISMUTH; COMPOSITION; COPPER ALLOYS; ELECTRON MICROSCOPY; GRAIN BOUNDARIES; IMPURITIES; POLYCRYSTALS; SOLUBILITY; THERMAL EFFECTS; THERMODYNAMIC STABILITY;

ANALYTICAL ELECTRON MICROSCOPY; FOWLER TYPE BEHAVIOUR; GRAIN BOUNDARY SEGREGATION; MCLEAN TYPE BEHAVIOUR; SEGREGATION ENERGY; TEMPERATURE JUMP;

SEGREGATION (METALLOGRAPHY);

EID: 0031236479     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(97)00171-1     Document Type: Article

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