Cracking and phase transformation in silicon during nanoindentation

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 313-318

  Jang, Jae Il ^a,b   Wen, Songqing ^a   Lance, M J ^b   Anderson, I M ^b   Pharr, G M ^a,b  

^a University of Tennessee Knoxville   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRYSTALLINE MATERIALS; DIAMONDS; FRACTURE TOUGHNESS; HARDNESS; INDENTATION; MACHINING; PHASE TRANSITIONS; PLASTIC DEFORMATION; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SINGLE CRYSTALS; STRESS ANALYSIS;

CRACK LENGTHS; FIELD-EMISSION SCANNING ELECTRON MICROSCOPY (FESEM); HARDNESS IMPRESSION; NANOINDENTATION;

SILICON;

EID: 2442428353     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u8.15     Document Type: Conference Paper

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