Reliability of contacts for press-pack high-power devices

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1676-1681

  Vobecky J ^a   Kolesnikov, D ^a  

^a CZECH TECHNICAL UNIVERSITY IN PRAGUE   (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POTENTIAL; RELIABILITY; SEMICONDUCTOR DIODES; SILICON; STRESS ANALYSIS; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

FREE-FLOATING SILICON; HIGH-POWER DEVICES; POWER LOADS; VOLTAGE DROP;

ELECTRONICS PACKAGING;

EID: 24144482832     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.076     Document Type: Conference Paper

References (5)

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2. J. Cook, M. Azam, P. Leung, and M. Gruppen Performance of vertical power devices with contact-level copper metallization Thin Solid Fims 348 1999 14 21
3. J. Vobecký, and P. Hazdra Advanced Local Lifetime Control for Higher Reliability of Power Devices Microelectronics Reliability 43 2003 1883 1888
4. Phase Control Thyristors, ABB Semiconductors AG, Lenzburg, 1996.
5. J.F. Jongste, J.P. Lokker, G.C.A.M. Janssen, S. Radelaar, J. Torres, and J. Palleau Mechanical reliability of CVD-copper thin films Microelectr. Eng. 33 1997 39 46