Laser-induced stress wave thermometry applied to silicon wafer processing: Modeling and experimentation

Experimental Mechanics

Volumn 45, Issue 1, 2005, Pages 3-8

  Rabroker, G A ^a   Suh, C S ^a   Chona, Ravi ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

Fiber tip interferometry; RTP; TAP NDE; Ultrasonic lamb waves; Wavelet transform

Indexed keywords

ANISOTROPY; ELASTIC MODULI; INTERFEROMETRY; LASER APPLICATIONS; MATHEMATICAL MODELS; NONDESTRUCTIVE EXAMINATION; PROCESSING; SILICON WAFERS; SUBSTRATES; THERMAL EFFECTS; ULTRASONIC WAVES; WAVELET TRANSFORMS;

ELASTIC CONSTANTS; FIBER TIP INTERFEROMETRY; LASER-INDUCED STRESS WAVE THERMOMETRY; SILICON WAFER PROCESSING; ULTRASONIC LAMB WAVES;

TEMPERATURE MEASUREMENT;

WAVE;

EID: 24144468139     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1177/0014485105050007     Document Type: Article

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