REBECA-3D 1: The thermal conductive solver for microelectronics

Microelectronics Journal

Volumn 29, Issue 9, 1998, Pages 651-656

  Fradin, J P ^a   Desaunettes, B ^a  

^a Epsilon Ingenierie California V 5   (France)

Author keywords

Boundary element method; Conductive solver; Modelling; Scale difference; Thermal analysis

Indexed keywords

BOUNDARY ELEMENT METHOD; COMPUTER SIMULATION; COMPUTER SOFTWARE; HEAT TRANSFER; MATHEMATICAL MODELS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; THERMOANALYSIS; THREE DIMENSIONAL;

CONDUCTIVE SOLVER; SCALE DIFFERENCE; SOFTWARE PACKAGE REBECA 3D;

MICROELECTRONICS;

EID: 0032164330     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2692(98)00030-5     Document Type: Article

References (7)

1. C.A. Brebbia, J. Dominguez, Boundary Element: An Introductory Course, Comp. Mech. Publications, McGraw-Hill Book Company, New York, 1991.
2. J.P. Fradin, B. Desaunettes, REBECA-3D: The software for conductive fluxes and temperature fields prediction, 26th ICES, Monterey, 8-11 July 1996.
3. J.P. Fradin, B. Desaunettes, Calculations of the temperature distribution throughout electronic equipments by the B.E.M. with the REBECA-3D software, Eurotherm 45: Thermal Management of Electronic Systems, September 1995.
4. J.P. Fradin, L. Molla, B. Desaunettes, Analysis of 3D conjugate heat transfers, European Design and Test Conference, Proceedings, ED&TC97, March 1997, pp. 190-194.
5. J.P. Fradin, B. Desaunettes, REBECA-3D: a thermal tool for the design of electronic devices. ED&TC97, User Forum, March 1997, pp. 111-115.
6. J.P. Fradin, B. Desaunettes, Automatic computation of conductive conductances intervening in the thermal chain, 25th International Conference on Environmental Systems, San Diego, CA, 10-13 July 1995.
7. M. Bouafia, B. Desaunettes, J.P. Fradin, J.J. Vullierme, Méthode des eléments de frontiére ulilisée pour les problémes de thermoélasticité: application aux composants electroniques, SFT, 1997, Toulouse.