Microstructure and properties of Cu-Cr-Zr alloy after rapidly solidified aging and solid solution aging

Journal of Materials Science and Technology

Volumn 21, Issue 4, 2005, Pages 475-478

  Liu, Ping ^a   Su, Juanhua ^a,b   Dong, Qiming ^a   Li, Hejun ^b  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Cu Cr Zr alloy; Properties; Rapidly solidified aging; Solid solution aging

Indexed keywords

AGING OF MATERIALS; CHROMIUM ALLOYS; COPPER ALLOYS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HARDNESS; MICROSTRUCTURE; RAPID SOLIDIFICATION; SOLID SOLUTIONS; ZIRCONIUM ALLOYS;

CR PARTICLES; CU-CR-ZR ALLOY; SOLID SOLUTION TREATMENT;

ELECTRIC CONDUCTIVITY;

EID: 23944524170     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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