Acceleration of Cu surface precipitation from bulk by adsorbed organic molecules

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 6 A, 2005, Pages 3793-3797

  Ohkubo, Yasuo ^a   Matsumoto, Kei ^a   Nagai, Kiyoshi ^a  

^a Komatsu Electronic Metals Co Ltd   (Japan)

Author keywords

Adsorption; Cu; Organic molecules; Out diffusion; Silicon wafer; Surface potential

Indexed keywords

ADSORPTION; DIFFUSION; MOLECULES; PRECIPITATION (CHEMICAL); SILICON WAFERS; SURFACES;

ORGANIC MOLECULES; OUT DIFFUSION; SURFACE POTENTIAL;

COPPER;

EID: 23944522263     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.3793     Document Type: Article

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