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Volumn 21, Issue 7, 2005, Pages 869-872
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Test method for the presence or absence of Pb in electrical components using energy-dispersive micro X-ray fluorescence
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL ANALYSIS;
COPPER ALLOYS;
COPPER METALLOGRAPHY;
ENERGY DISPERSIVE SPECTROSCOPY;
FLUORESCENCE;
INDUCTIVELY COUPLED PLASMA MASS SPECTROMETRY;
LEAD-FREE SOLDERS;
MICROMETERS;
QUALITY CONTROL;
RELIABILITY ANALYSIS;
SCANNING ELECTRON MICROSCOPY;
SCREENING;
SILVER ALLOYS;
SILVER METALLOGRAPHY;
TERNARY ALLOYS;
TESTING;
THIN FILMS;
TIN ALLOYS;
TIN METALLOGRAPHY;
X RAYS;
CALCULATION PARAMETERS;
ELECTRICAL COMPONENTS;
ENERGY DISPERSIVE;
ENERGY DISPERSIVE X-RAY FLUORESCENCE;
INDUCTIVELY COUPLED PLASMA MASS SPECTROMETRIES (ICPMS);
MICRO X-RAY FLUORESCENCE;
SCREENING METHODS;
TESTING RELIABILITY;
LEAD METALLOGRAPHY;
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EID: 23944497612
PISSN: 09106340
EISSN: 13482246
Source Type: Journal
DOI: 10.2116/analsci.21.869 Document Type: Article |
Times cited : (3)
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References (12)
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