Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects

IEEE Photonics Technology Letters

Volumn 17, Issue 7, 2005, Pages 1516-1518

  Park, Sang Hyun ^a   Park, Sung Min ^b   Park, Hyo Hoon ^a   Park, Chul Soon ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Ewha Womans University   (South Korea)

Author keywords

Channel crosstalk; Flip chip; Low temperature cofiring ceramic (LTCC) substrate; Parallel optical interconnects; Transimpedance amplifier

Indexed keywords

AMPLIFIERS (ELECTRONIC); ARRAYS; CAPACITANCE; CERAMIC MATERIALS; COMMUNICATION CHANNELS (INFORMATION THEORY); CROSSTALK; FLIP CHIP DEVICES; HETEROJUNCTION BIPOLAR TRANSISTORS;

CHANNEL CROSSTALK; FLIP CHIP ARRAY MODULE; LOW TEMPERATURE COFIRING CERAMIC (LTCC) SUBSTRATE; PARALLEL OPTICAL INTERCONNECTS; TRANSIMPEDANCE AMPLIFIER;

OPTICAL INTERCONNECTS;

EID: 23844536188     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2005.848562     Document Type: Article

References (6)

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