Polymer optical interconnect technologies for polylithic gigascale integration

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 45-51

  Mule, Anthony V ^a   Villalaz, Ricardo ^a   Jayachandran, Joseph P ^a   Kohl, Paul A ^a   Gaylord, Thomas K ^a   Meindl, James D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP-CHIP BONDING; POLYLITHIC INTEGRATION; POLYMER OPTICAL INTERCONNECT; PROPAGATION LOSS MEASUREMENTS;

BANDWIDTH; MICROELECTRONICS; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; REFRACTIVE INDEX; SILICON;

OPTICAL INTERCONNECTS;

EID: 23844524130     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. J. W. Goodman, F. J. Leonberger, S. C. Kung, R. A. Athale, Proc. IEEE 72, 850-66 (1984).
2. A. Naeemi, C. S. Patel, M. S. Bakir, P. Zarkesh-Ha, K. P. Martin, and J. D. Meindl in International Solid State Circuits Conference (IEEE Proc., San Francisco, CA, 2001) pp. 280-281.
3. M. S. Bakir, H. D. Thackcr, Z. Zhou, P. A. Kohl, K. P. Martin, and J. D. Meindl in International Interconnect Technology Conference (IEEE Proc., San Diego, CA, 2002) pp. 1087-1094.