Microstructure Studies of Under Bump Metallization Systems Using Transmission Electron Microscopy

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2002, Pages 505-511

  Tung, Chih Hang ^a   Sheng, George T T ^b   Teo, Poi Siong ^a   Lo, Marvin C Y ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b MACRONIX INTERNATIONAL CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; METALLIZING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

PHASE IDENTIFICATION; UNDER BUMP METALLIZATION (UBM);

TIN COMPOUNDS;

EID: 1542300277     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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7. th International Symposium on Microelectronics, Baltimore, USA, Oct 9-11, 2001.
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