Application of electro-chemical polishing in di water to Cu damascene wiring planarization process

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 577-582

  Noji, Ikutarou ^a   Kobata, Itsuki ^a   Yasuda, Hozumi ^a   Iizumi, Takeshi ^a   Kumekawa, Masayuki ^a   Wada, Yutaka ^a   Fukunaga, Akira ^a   Tsujimura, Manabu ^a   Toma, Yasushi ^a   Suzuki, Tsukuru ^a   Saitoh, Takayuki ^a  

^a EBARA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSTS; COPPER; CURRENT DENSITY; DEPOSITION; ELECTRIC CURRENTS; ELECTRIC WIRING; ELECTRODES; ELECTROLYTES; ION EXCHANGE; IONIZATION OF LIQUIDS; WATER;

DAMASCENE WIRING; ELECTROCHEMICAL REACTIONS; ELECTRODE STRUCTURE; ELECTROLYTIC SOLUTIONS;

ELECTROLYTIC POLISHING;

EID: 23844506501     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Y. Mori et al., JSPE Publication Series No. 3 (1999) p. 237
2. Y. Mori et al., Journal of the Japan Society for Precision Engineering (in Japanese), 67, 6 (2001) p. 932
3. Y. Mori et al., Journal of the Japan Society for Precision Engineering (in Japanese), 68, 9 (2002) p. 1241