Alpha-Ta formation and its impact on electromigration

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 355-359

  Demuynck, S ^a   Tokei, Zs ^a   Bruynseraede, C ^d   Michelon, J ^b   Maex, K ^a,c  

^a IMEC   (Belgium)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c UNIVERSITY OF LEUVEN   (Belgium)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; MICROSTRUCTURE; NUCLEATION; PHYSICAL VAPOR DEPOSITION; TANTALUM COMPOUNDS; THIN FILMS;

BILAYER THICKNESS; EDGE EXCLUSION; PHASE FORMATION; SINGLE LAYER BARRIERS;

ELECTROMIGRATION;

EID: 23844500656     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. M. Traving, G. Schindler, G. Steinlesberger, W. Steinhögl, M. Engelhardt, Proc. AMC 2002, San Diego, p. 753.
2. J. C. Lin, S. K. Park, K. Pfeifer, R. Augur, V. Blaschke, S. L. Shue, C. H. Yu, M. S. Liang, Proc. AMC 2002, San Diego, p. 233
3. D.Edelstein, C. Uzoh, C. Cabrai, P. DeHaven, P. Buchwalter, A.Simon, E. Cooney, S. Malhotra, D. Klaus, H. Rathore, B. Agarwala, D. Nguyen, Proc. IITC 2001, San Francisco, June 2001, p. 9.
4. H. Donohue, H. Gris, J.C. Yeoh, K. Buchanan, Proc. IITC 2002, San Francisco, June 2002, p. 179