Investigation of indoor climate and power usage in a data center

Energy and Buildings

Volumn 37, Issue 10, 2005, Pages 1075-1083

  Karlsson, J Fredrik ^a   Moshfegh, Bahram ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

Author keywords

Airflow pattern; Data center; Indoor climate; IR camera; Power requirement; Thermal management; Visualization

Indexed keywords

AIR; AIR CONDITIONING; CLIMATE CHANGE; COOLING; ELECTRIC POWER SYSTEMS; HEATING; HOUSING; TEMPERATURE INDICATING CAMERAS; VENTILATION; VISUALIZATION;

AIRFLOW PATTERN; DATA CENTRES; INDOOR CLIMATE; INFRARED CAMERAS; POWER REQUIREMENTS; THERMAL MANAGEMENT;

ENERGY UTILIZATION;

EID: 23844482541     PISSN: 03787788     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enbuild.2004.12.014     Document Type: Article

References (14)

1. J. Mitchell-Jackson, J.G. Koomey, B. Nordman, and M. Blazek Data center power requirements: measurements from Silicon Valley Energy 28 8 2003 837 850
2. C.D. Patel, R. Sharma, C.E. Bash, and A. Beitelmal Thermal considerations in cooling large scale high compute density data centers Proceedings of 2002 Inter Society Conference on Thermal Phenomena 2002
3. The Uptime Institute, Heat density trends in data processing, computer systems, and telecommunications equipment, White paper, Santa Fe, NM, The Upsite Network, 2000, http://www.upsite.com/TUIpages/whitepapers/tuiheat1.0.html.
4. P.W. Turner, E.C. Koplin, Changing cooling requirements leave many data centers at risk, White paper, Santa Fe, NM, The Upsite Network, 2000, http://www.upsite.com/TUIpages/whitepapers/tuicooling.html.
5. D.G. Wang, and P.K. Muller Improving cooling efficiency by increasing fan power usage Microelectronics Journal 31 9-10 2000 765 771
6. R.R. Schmidt, Effect of data center characteristics on data processing equipment inlet temperatures, in: Proceedings of IPACK'01, July 2001, Kauai, Hawaii, USA.
7. S. Kang, R.R. Schmidt, K.M. Kelkar, A. Radmehr, and S.V. Patankar A methodology for the design of perforated tiles in raised floor data centers using computational flow analysis IEEE Transactions on Computer and Packaging Technologies 24 2 2001 177 183
8. C.W. Argento, Y.K. Joshi, and M.D. Osterman Forced convection air-cooling of a commercial electronic chassis: an experimental and computational case study IEEE Transactions on Components, Packaging and Manufacturing Technology: Part A 19 2 1996 248 257
9. M.D. Giraldo, Mechanical packaging of HP's superdome server, in: Proceedings of IPACK'01, 8-13 July 2001, Kauai, Hawaii, USA.
10. R.R. Schmidt, and H. Shaukatullah Computer and telecommunications equipment room cooling: a review of literature IEEE Transactions on Components and Packaging Technologies 26 2 2003 89 98
11. F. Karlsson, B. Moshfegh, Investigation of indoor air and energy use in a data center, Presented at ScandTherm 2002 of First Scandinavian Conference on Cooling of Electronics, Stockholm, 17 June 2002.
12. M. Cehlin, B. Moshfegh, and M. Sandberg Measurement of air temperatures close to a low-velocity diffuser in displacement ventilation using an infrared camera Energy and Buildings 34 7 2002 687 698
13. C.A. Balaras, and A.A. Argiriou Infrared thermography for building diagnostics Energy and Buildings 34 2 2002 171 183
14. C. Wilkins, and M.H. Hosni Heat gain from office equipment ASHRAE Journal 42 6 2000 33 44