Improving cooling efficiency by increasing fan power usage

Microelectronics Journal

Volumn 31, Issue 9, 2000, Pages 765-771

  Wang, D G ^a   Muller, P K ^a  

^a NCR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; OPTIMIZATION; TURBULENT FLOW;

SYSTEM LEVEL COOLING;

INTEGRATED CIRCUIT LAYOUT;

EID: 0034301539     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(00)00057-4     Document Type: Article

References (12)

1. D. Wang, Cooling solutions for a no-air-flow and low-junction-temperature application, Second Electronics Packaging Technology Conference, Singapore, 1998, pp. 133-137.
2. Bush C., Patel C. Modeling and metrology for expedient analysis and design of computer systems. The International Journal of Microcircuits and Electronic Packaging. 22:(2):1999;157-163.
3. Belady C. Standardizing heat sink characterization for forced convection. Electronics Cooling. 3:(3):1997;24-25.
4. Simons R., Schmidt R. A simple method to estimate heat sink air flow bypass. Electronics Cooling. 3:(2):1997;36-37.
5. T. Yuan, Computation modeling of flow bypass effects on straight fin heat sink in rectangular duct, 12th IEEE SEMI-THERM Symposium, 1996, pp. 164-168.
6. R. Lee, H. Huang, W. Chen, A thermal characteristic study of extruded-type heat sinks in considering air flow bypass phenomenon, Sixth IEEE SEMI-THERM Symposium, 1990, pp. 95-102.
7. Aung W. Cooling Techniques for Computers. 1991;Hemisphere, Washington, DC.
8. Ellison G. Thermal Computations for Electronic Equipment. 1989;Krieger, New York.
9. Burmeister L. Convective Heat Transfer. 1983;Wiley, New York.
10. Kim S., Lee S. Air Cooling Technology for Electronic Equipment. 1996;CRC Press, Boca Raton, FL.
11. Fried E., Idelchik E. Flow Resistance. 1989;Hemisphere, Washington, DC.
12. Avallone E., Baumeister T. III. Marks Standard Handbook for Mechanical Engineers. 9th ed. 1986;McGraw-Hill, New York.