Microscopic imaging of RF current distribution and intermodulation sources in superconducting microwave devices

Materials Research Society Symposium Proceedings

Volumn EXS, Issue 3, 2004, Pages 209-211

  Zhuravel, A P ^a   Ustinov, A V ^b   Harshavardhan, K S ^c   Remillard, S K ^d   Anlage, Steven M ^e  

^a B VERKIN INSTITUTE FOR LOW TEMPERATURE PHYSICS AND ENGINEERING   (Ukraine)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^c Neocera Inc   (United States)

^d Agile Devices   (United States)

^e UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; FLUXES; HIGH TEMPERATURE EFFECTS; IMAGING TECHNIQUES; INTERMODULATION MEASUREMENT; MICROSCOPIC EXAMINATION; MICROSTRIP DEVICES; MICROWAVE DEVICES; SUPERCONDUCTING TRANSITION TEMPERATURE;

INTERMODULATION SIGNALS (IM); LASER SCANNING MICROSCOPE (LSM); RF CURRENT DISTRIBUTION; SUPERCONDUCTING MICROWAVE DEVICES;

SUPERCONDUCTING DEVICES;

EID: 23844431596     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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