Analysis of tensile strength and microstructure of Ni-SiC composites prepared by electroforming

Materials Letters

Volumn 59, Issue 24-25, 2005, Pages 3014-3017

  Liu, Lei ^a   Zhao, Haijun ^a   Hu, Wenbin ^a   Shen, Bin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Electroforming; Fracture; Interfacial reaction; Microstructure; Nickel SiC composites; Tensile strength

Indexed keywords

BRITTLE FRACTURE; DEBONDING; ELECTROFORMING; HEAT TREATMENT; INTERFACES (MATERIALS); INTERFACIAL ENERGY; MICROCRACKS; MICROSTRUCTURE; NICKEL; PORE SIZE; SHRINKAGE; SILICON CARBIDE; SYNTHESIS (CHEMICAL); TENSILE STRENGTH;

INTERFACIAL REACTIONS; NICKEL-SIC COMPOSITES; SHRINKAGE PORES; SPRAY DEPOSITION;

COMPOSITE MATERIALS;

EID: 23744466634     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2005.03.073     Document Type: Article

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