Lead Free, Zero Shrink, Substrate Bonded LTCC System

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 206-211

  Wahlers, R L ^a   Feingold, A H ^a   Heinz, M ^a  

^a Electro Science Lab Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INDUCTORS; LEAD FREE TAPES; LOW LOSS TRANSMISSIONS LINES; PHOTOIMAGEING;

ALUMINA; CAPACITORS; ELECTRIC INDUCTORS; ELECTRIC TAPES; LAMINATING; LEAD; OPTIMIZATION; SILVER; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

MICROELECTRONICS;

EID: 2342587523     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. K.Snowdon; Towards a Green 2000; proceedings of IMAPS Europe, June 1999; pp. 71-77
2. Application Note, Electro-Science Laboratories, Low Temperature Cofire Ceramic Tape
3. Application Note, Electro-Science Laboratories, Transfer Tape Processing
4. A.H. Feingold, C. Huang, and S.J. Stein; Low K, Low Loss, Low Fire Tape System for Microwave Applications; Proceedings IMAPS Europe, Prague, 2000, pp. 163-168
5. A.H. Feingold, M. Heinz, and R.L. Wahlers; dielectric and Magnetic Materials for Integrated Passives; Proceedings Ceramic Interconnect Technology, Denver, 2003; pp.189-194
6. F.S. Burkett; Improved Designs for Thin Film Inductors; Proceedings of ECC; 1971;pp.184-194