Dielectric and magnetic materials for integrated passives

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5231, Issue , 2003, Pages 189-194

  Feingold, A H ^a   Heinz, M ^a   Wahlers, R L ^a  

^a Electro Science Lab Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPOSITION; DIELECTRIC MATERIALS; FIRING (OF MATERIALS); MAGNETIC PERMEABILITY; MAGNETIC TAPE; METALLIZING; SCANNING ELECTRON MICROSCOPY; TEMPERATURE;

INDUCTORS; INTEGRATED PASSIVES; LOW TEMPERATURE COFIRED CERAMIC;

CERAMIC MATERIALS;

EID: 0042329671     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. A.H. Feingold, M. Heinz, and R.L. Wahlers; Compliant Dielectric and Magnetic Materials for Buried Components; Proceedings of IMAPS Denver, 2002 pp. 65-70
2. A.H. Feingold, R.L. Wahlers, and S.J. Stein; Lead Free Dielectric Tape Systems for High Frequency Applications; Proceedings of IMAPS Baltimore, October 2001
3. A.H. Feingold, C. Huang, and S.J. Stein,; Low K, Low Loss, Low Fire Tape System for Microwave Applications; Proceedings of IMAPS Europe Prague June 2000; 163-168
4. Motorola Private Communication
5. R.L. Wahlers, C.Y.D. Huang, M.R. Heinz, A.H. Feingold, J. Bielawski and G. Slama; Low Profile Transformers; Proceedings of IMAPS Denver, 2002, pp 76-80
6. W.A. Roshen; Effect of finite Thickness of Magnetic Substrate on Planar Inductors; IEEE Transactions on magnetics, vol 26, No. 1 January 1990, pp 270-275
7. F.S. Burkett, Improved Designs for Thin Film Inductors, Proceedings of the 1971 ECC Conference, pp 184-194