Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density

Materials Letters

Volumn 58, Issue 15, 2004, Pages 2091-2095

  Seo, Yong Jin ^a   Kim, Sang Yong ^b   Choi, Yeon Ok ^c   Oh, Yong Taek ^c   Lee, Woo Sun ^c  

^a Daebul University   (South Korea)

^b DongbuAnam Semiconductor Inc   (South Korea)

^c Chosun University   (South Korea)

Author keywords

Chemical mechanical polishing; Defects; Multilayer structure; Pad lifetime; Point of use; Slurry filter; Solidification

Indexed keywords

ABRASIVES; AGGLOMERATION; DEFECTS; MOLECULAR STRUCTURE; MULTILAYERS; PARTICLE SIZE ANALYSIS; SILICON WAFERS; SOLIDIFICATION; ULSI CIRCUITS;

MULTILAYER STRUCTURE; PAD LIFETIME; POINT OF USE; SLURRY FILTERS;

CHEMICAL MECHANICAL POLISHING;

EID: 2342584702     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.01.012     Document Type: Article

References (7)

1. Bath S.H., Legegett R., Maury A., Monning K., Tolles R. Solid State Tech. 35:1992;87.
2. Seo Y.J., Kim C.B., Kim S.Y. Proceeding of Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC). 2001;527 IMIC (Institute for Microelectronics Inter-Connections).
3. Lee W.S., Kim S.Y., Seo Y.J., Lee J.K. J. Mater. Sci., Mater. Electron. 12:2001;63.
4. Seo Y.J., Lee W.S., Kim S.Y., Park J.S., Chang E.G. J. Mater. Sci., Mater. Electron. 12:2001;411.
5. Lin M., Chang C.Y., Liao D.C., Wang B., Henderson A. Proc. of CMP-MIC. 1999;322 IMIC (Institute for Microelectronics Inter-Connections).
6. Lin Z., Zahkaok J., Vasilopoulos G. SEMICON West 97:1997 (July 13).
7. Huang J., Chen H.C., Wu J.Y., Lur W. Proc. of CMP-MIC. 1999;77 IMIC (Institute for Microelectronics Inter-Connections).