Optimization of post-CMP cleaning process for elimination of CMP slurry-induced metallic contaminations

Journal of Materials Science: Materials in Electronics

Volumn 12, Issue 7, 2001, Pages 411-415

  Seo, Y J ^a   Lee, W S ^b   Kim, S Y ^c   Park, J S ^b   Chang, E G ^d  

^a Daebul University   (South Korea)

^b Chosun University   (South Korea)

^c DongbuAnam Semiconductor Inc   (South Korea)

^d Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CONTAMINATION; DOPING (ADDITIVES); FLUORESCENCE; OPTIMIZATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

TOTAL X-RAY FLUORESCENCE (TXRF);

METAL CLEANING;

EID: 0035389055     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1011242900843     Document Type: Article

References (8)