Evaluation by ultrasonic testing and TEM observation of bond interface for ultrasonic bonds of 5052/SUS304 and 5052/SPCC

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society

Volumn 23, Issue 2, 2005, Pages 194-202

  Abdel Aleem, Hamed ^a   Katoh, Mitsuaki ^a   Nishio, Kazumasa ^a   Yamaguchi, Tomiko ^a   Tsue, Yusuke ^a  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Aluminum alloy; Intermetallic compound; SPCC; SUS304; TEM; Tensile shear test; Ultrasonic bonding; Ultrasonic testing

Indexed keywords

ALUMINUM ALLOYS; DISSIMILAR MATERIALS; INTERFACES (MATERIALS); IRON; STEEL; THERMAL EXPANSION; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONIC TESTING; VACUUM;

INTERMETALLIC COMPOUND; SPCC; SUS304; TENSILE SHEAR TEST; ULTRASONIC BONDING;

JOINTS (STRUCTURAL COMPONENTS);

EID: 23144440914     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.23.194     Document Type: Article

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