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Volumn 21, Issue 4, 2003, Pages 493-500
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Joining of A1050/A5052 and A1050/Cu by ultrasonic bonding and their materials evaluation
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Author keywords
C scope method; Nano crystal; Shear test; Ultrasonic joining; Ultrasonic testing
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Indexed keywords
BONDING;
CRACK INITIATION;
CRACK PROPAGATION;
DEFORMATION;
MATERIALS TESTING;
MICROSTRUCTURE;
RADIOGRAPHY;
TRANSMISSION ELECTRON MICROSCOPY;
ULTRASONIC TESTING;
ULTRASONIC WAVES;
C-SCOPE METHOD;
NANO-CRYSTALS;
SHEAR TESTS;
ULTRASONIC JOINING;
BINARY ALLOYS;
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EID: 4344631973
PISSN: 02884771
EISSN: None
Source Type: Journal
DOI: 10.2207/qjjws.21.493 Document Type: Article |
Times cited : (10)
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References (8)
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