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Volumn 21, Issue 4, 2003, Pages 493-500

Joining of A1050/A5052 and A1050/Cu by ultrasonic bonding and their materials evaluation

Author keywords

C scope method; Nano crystal; Shear test; Ultrasonic joining; Ultrasonic testing

Indexed keywords

BONDING; CRACK INITIATION; CRACK PROPAGATION; DEFORMATION; MATERIALS TESTING; MICROSTRUCTURE; RADIOGRAPHY; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONIC TESTING; ULTRASONIC WAVES;

EID: 4344631973     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.21.493     Document Type: Article
Times cited : (10)

References (8)
  • 7
    • 84862409969 scopus 로고
    • Maruzen
    • Japan Welding Society: Yosetu·Setugou Binran, Maruzen, pp.501-502 (1995)
    • (1995) Yosetu·Setugou Binran , pp. 501-502
  • 8
    • 4344638946 scopus 로고
    • CORONA
    • Japan Electronics and Information Technology Industries Association, Ultrasonic Engineerring.CORONA, pp. 162-168, (1993).
    • (1993) Ultrasonic Engineerring , pp. 162-168


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.