Jet impingement cooling of chips equipped with cylindrical pedestal profile fins

Journal of Electronic Packaging

Volumn 127, Issue 2, 2005, Pages 106-111

  Chung, Y S ^a   Lee, D H ^b   Ligrani, P M ^c  

^a SAMSUNG Electronics   (South Korea)

^b Inje University   (South Korea)

^c University of Utah   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; DATA ACQUISITION; FINS (HEAT EXCHANGE); HEAT TRANSFER; INTEGRATED CIRCUIT MANUFACTURE; NUSSELT NUMBER; SEMICONDUCTOR MATERIALS; TEMPERATURE MEASUREMENT; THERMOCOUPLES; VELOCITY MEASUREMENT;

FLOW STREAMLINES; IMPINGING JETS; JET IMPINGEMENT COOLING; PEDESTAL PROFILE FINS;

MICROPROCESSOR CHIPS;

EID: 22944493011     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1849235     Document Type: Article

References (16)

1. Fedorov, A. G., and Viskanta, A., 1997, "A Numerical Simulation of Conjugate Heat Transfer in an Electronic Package Formed by Embedded Discrete Heat Sources in Contact With Porous Heat Sink," ASME Trans. J. Electron. Packag., 119, pp. 8-16.
2. Weiss, J., Fortner, P., Pearson, B., Watson, K., and Monroe, T., 1989, "Modeling Air Flow in Electronic Package," Mech. Eng. (Am. Soc. Mech. Eng.), pp. 56-58.
3. Copeland, D., 1996, "Single-Phase and Boiling Cooling of Small Pin Fin Arrays of Multiple Nozzle Jet Impingement," ASME Trans. J. Electron. Packag., 118, pp. 21-26.
4. Sparrow, E. M., and Larson, E. D., 1982, "Heat Transfer From Pin-Fins Situated in an Oncoming Longitudinal Flow Which Turns to Crossflow," Int. J. Heat Mass Transfer, 25(5), pp. 603-614.
5. Wadsworth, D. C., 1989, "Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid," M.S. thesis, Purdue University, IN.
6. Sullivan, P. F., Ramadhyani, S., and Incropera, F. P., 1992, "Extended Surfaces to Enhanced Impingement Cooling With Single Circular Liquid Jets," ASME paper no. EEP-1-1, Proceedings of the ASME/JSME Joint Conference on Electronic Packaging, San Jose, CA, pp. 207-216.
7. Sullivan, P. F., Ramadhyani, S., and Incropera, F. P., 1992, "Use of Smooth and Roughened Spreader Plates to Enhance Impingement Cooling With Single Circular Liquid Jets," ASME paper no. HTD-206-2, National Heat Transfer Conference, San Diego, CA, pp. 103-110.
8. Teuscher, K. L., 1992, "Packaging Methods for Jet Impingement Cooling of an Array of Discrete Heat Sources," M.S. thesis, Purdue University, IN.
9. Baughn, J. W., Mesbah, M., and Yan, X., 1993, "Measurements of Local Heat Transfer for an Impinging Jet on a Cylindrical Pedestal," ASME-Turbulent Enhancement Heat Transf., HTD-239, pp. 57-62.
10. Parneix, S., Behnia, M., and Durbin, P. A., 1999, "Predictions of Turbulent Heat Transfer in an Axisymmetric Jet Impinging on a Heated Pedestal," ASME Trans. J. Heat Transfer, 121, pp. 43-49.
11. Dunne, S. T., 1983, "A Study of Flow and Heat Transfer in Gas Turbine Cooling Passages," Ph.D. thesis, Oxford University, UK.
12. Kline, S. J., and McKlintock, F. A., 1953, "Describing Uncertainties in Single Sample Experiments," Mech. Eng. (Am. Soc. Mech. Eng.), 75, pp. 3-8.
13. Rajaratnam, N., 1976, Turbulent Jet, Elsevier Scientific Publishing Corporation, The Netherlands.
14. Lee, D. H., Song, J., and Jo, M. C., 2004, "The Effects of Nozzle Diameter on Impinging Jet Heat Transfer and Fluid Flow," ASME J. Heat Transfer, 126, pp. 554-557.
15. Baughn, J. W., and Shimizu, S., 1989, "Heat Transfer Measurement From a Surface With Uniform Heat Flux and an Impinging Jet," ASME Trans. J. Heat Transfer, 111, pp. 1096-1098.
16. Gardon, R., and Cobonpue, J., 1962, "Heat Transfer Between a Flat Plate and Jets in Air Impinging on It," Int. Development Heat Transfer, pp. 454-459.