Single-phase and boiling cooling of small pin fin arrays by multiple nozzle jet impingement

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 1, 1996, Pages 21-26

  Copeland, David ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FINS (HEAT EXCHANGE); HEAT FLUX; HEAT TRANSFER COEFFICIENTS; JETS; NOZZLES;

BOILING COOLING; HEAT SOURCE; MULTIPLE NOZZLE JET IMPINGEMENT; PIN FIN ARRAYS;

ELECTRONICS PACKAGING;

EID: 0030109825     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792122     Document Type: Article

References (10)

1. Bar-Cohen, A., 1993, “Thermal Management of Electronic Components with Dielectric Liquids,” JSME International Journal Series B, Vol. 35, No. 1, pp. 1-25
2. Copeland, D., 1992, “Single-Phase and Boiling Cooling of a Small Heat Source by Multiple Nozzle Jet Impingement,” ASME Winter Annual Meeting, Paper 92-WA/EEP-4; 1996, International Journal of Microelectronic Packaging, in press.
3. Hansen, L. G., and Webb, B. W., 1993, “Air Jet Impingement Heat Transfer from Modified Surfaces,” International Journal of Heat and Mass Transfer, Vol. 36, No. 4, pp. 989-997.
4. Mudawar, I., and Maddox, D. E., 1990, “Enhancement of Critical Heat Flux from High Power Microelectronic Heat Sources in a Flow Channel,” ASME Journal of Electronic Packaging, Vol. 112, No. 3, pp. 241-248.
5. Mudawar, I., and Wadsworth, D. C., 1991, “Critical Heat Flux from a Simulated Chip to a Confined Rectangular Impinging Jet of Dielectric Liquid,” International Journal of Heat and Mass Transfer, Vol. 34, No. 6, pp. 1465-1479.
6. Priedeman, D., Callahan, V., and Webb, B. W., “Enhanced Surface Liquid Jet Impingement Heat Transfer,” Enhanced Cooling Techniques for Electronics Applications, ASME HTD-Vol. 263, pp. 43-48.
7. Sullivan, P. F., Ramadhyani, S., and Incropera, F. P., 1992, “Use of Smooth and Roughened Spreader Plates to Enhance Impingement Cooling of Small Heat Sources with Single Circular Liquid Jets,” Topics in Heat Transfer—Volume 2, ASME HTD-Vol. 206-2, pp. 103-110.
8. Teuscher, K. L., Ramadhyani, S., and Incropera, F. P., 1993, “Jet Impingement Cooling of an Array of Discrete Heat Sources with Extended Surfaces,” Enhanced Cooling Techniques for Electronics Applications, ASME HTD-Vol. 263, pp. 110.
9. Wadsworth, D., and Mudawar, I., 1992, “Enhancement of Single-Phase Heat Transfer and Critical Heat Flux from an Ultra-High-Flux Simulated Microelectronic Heat Source to a Rectangular Impinging Jet of Dielectric Liquid,” ASME Journal of Heat Transfer, Vol. 114, No. 3, pp. 764-768.
10. Yang, W.-J., Takizawa, H., and Vrable, D. L., 1991, “Augmented Boiling on Copper-Graphite Composite Surface,” International Journal of Beat and Mass Transfer, Vol. 34, No. 11, pp. 2751-2758.