Etching process of silicon dioxide with nonequilibrium atmospheric pressure plasma

Journal of Applied Physics

Volumn 98, Issue 1, 2005, Pages

  Yamakawa, Koji ^a   Hori, Masaru ^a   Goto, Toshio ^a   Den, Shoji ^b   Katagiri, Toshirou ^b   Kano, Hiroyuki ^c  

^a NAGOYA UNIVERSITY   (Japan)

^b Department of Engineering   (Japan)

^c NU EcoEngineering Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE PLASMAS; MICROWAVE PLASMAS; PLASMA EMISSIONS; WAFER PROCESSING;

ATMOSPHERIC PRESSURE; CHARGE COUPLED DEVICES; ETHANE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; ION BOMBARDMENT; MICROELECTROMECHANICAL DEVICES; PLASMA APPLICATIONS;

SILICA;

EID: 22944474620     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1944219     Document Type: Article

References (9)

1. C. R. Helms and B. E. Deal, J. Vac. Sci. Technol. A 11, 806 (1992).
2. D. L. Liang and W. D. Readey, J. Am. Ceram. Soc. 70, 570 (1987).
3. S. Okazaki, M. Kogoma, M. Uehara, and Y. Kimura, J. Phys. D 26, 889 (1993).
4. K. H. Schoenbach, A. El-Habachi, W. Shi, and M. Ciocca, Plasma Sources Sci. Technol. 6, 1156 (1997).
5. A. Kono, T. Sugiyama, T. Goto, H. Furuhashi, and Y. Uchida, Jpn. J. Appl. Phys., Part 2 40, L238 (2001).
6. K. Yamakawa, M. Hori, T. Goto, S. Den, T. Katagiri, and H. Kano, Proceedings of International Symposium on Dry Process, Tokyo, 2003 (unpublished), p. 277.
7. K. Yamakawa, M. Hori, T. Goto, S. Den, T. Katagiri, and H. Kano, Appl. Phys. Lett. 85, 549 (2004).
8. H. Ogawa, T. Arai, M. Yanagisawa, T. Ichiki, and Y. Horiike, Jpn. J. Appl. Phys., Part 1, 41, 5349 (2002).
9. M. Saito, Y. Kataoka, T. Homma, and T. Nagatomo, J. Electrochem. Soc. 147, 4630 (2000).