Microcapsule used for self-healing polymer material

Huagong Xuebao/Journal of Chemical Industry and Engineering (China)

Volumn 56, Issue 6, 2005, Pages 1138-1140

  Tian, Wei ^a   Wang, Xinhou ^a   Pan, Qiang ^a   Mao, Zhiping ^a  

^a DONGHUA UNIVERSITY   (China)

Author keywords

Fracture toughness; Microcapsule; Polymer material; Self healing

Indexed keywords

EPOXY RESINS; FORMALDEHYDE; FRACTURE TOUGHNESS; POLYMERIZATION; POLYMERS;

MICROCAPSULE; MICROCAPSULE CONTENT; POLYMER MATERIAL; SELF HEALING;

COMPOSITE MATERIALS;

EID: 22344448476     PISSN: 04381157     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

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