Mechanical properties of YBaCuO formed on Ni-based alloy substrates with IBAD buffer layers

IEEE Transactions on Applied Superconductivity

Volumn 15, Issue 2 PART III, 2005, Pages 3548-3551

  Shikimachi, Koji ^a   Kashima, Naoji ^a   Nagaya, Shigeo ^a   Muroga, Takemi ^b   Miyata, Seiki ^b   Watanabe, Tomonori ^b   Yamada, Yutaka ^b   Izumi, Teruo ^b   Shiohara, Yuh ^b  

^a CHUBU ELECTRIC POWER CO INC   (Japan)

^b SUPERCONDUCTIVITY RESEARCH LABORATORY   (Japan)

Author keywords

CeO2 buffer layer; IBAD; Mechanical property; MOCVD; YBaCuO

Indexed keywords

ION BEAM ASSISTED DEPOSITION; METALLORGANIC CHEMICAL VAPOR DEPOSITION; NICKEL ALLOYS; PULSED LASER DEPOSITION; STRESS ANALYSIS; TENSILE STRESS; THICKNESS MEASUREMENT;

BUFFER LAYERS; CEO2; COMPRESSIVE BEND STRESS; YBACUO;

SUPERCONDUCTING TAPES;

EID: 22044448367     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2005.849356     Document Type: Conference Paper

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