Rheological behavior of Al-Cu alloys during solidification: Constitutive modeling, experimental identification, and numerical study

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 36, Issue 6, 2005, Pages 1525-1535

  Ludwig, Olivier ^a,b   Drezet, Jean Marie ^b   Martin, Christophe L ^a   Suéry, Michel ^a  

^a GRENOBLE INSTITUTE OF TECHNOLOGY   (France)

^b EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; ISOTHERMS; MATHEMATICAL MODELS; POROUS MATERIALS; RHEOLOGY; SHEAR STRESS; SOLIDIFICATION; TENSILE STRENGTH; VISCOPLASTICITY;

RHEOLOGICAL BEHAVIOR; SOLIDIFYING ALLOY; VISCOPLASTIC POROUS MEDIUM;

ALUMINUM COPPER ALLOYS;

EID: 22044439998     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-005-0244-7     Document Type: Article

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