Implementation of CMRC on HBT power amplifier for WCDMA application

International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Volumn 3, Issue , 2004, Pages 2242-2245

  Poek, C K ^a   Yan, B P ^a   Yang, E S ^a  

^a UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CODE DIVISION MULTIPLE ACCESS; ETCHING; HETEROJUNCTION BIPOLAR TRANSISTORS; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PASSIVATION; PHOTOLITHOGRAPHY; SEMICONDUCTOR DEVICE STRUCTURES; WIRELESS TELECOMMUNICATION SYSTEMS;

ADJACENT CHANNEL LEAKAGE POWER RATIO (ACLR); CHANNEL BANDWIDTH; COMPACT MICROCHIP RESONANCE CELL (CMRC); PASSIVATION LAYER;

POWER AMPLIFIERS;

EID: 21644460690     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Joon H. Kim, Ji H. Kim, Youn S. Noh, oung S. Kim, Song G. Kim and Chul S. Park, "An MMI Smart Power Amplifier Of 21% PAE At 16dBm Power Level For W-CDMA Mobile Communication Tereminals", IEEE GaAs Digest, pp 181 -184, (2002)
2. T. B. Nishimura, M. Tanomura, K. Azuma. K. Nakai, Y. Hasegawa and H. Shimawaki, "A 50% Efficieny InGaP/GaAs HBT Power Amplifier Module for 1.95GHz Wide-Band CDMA Handsets" IEEE Radio Freqeuncy Integrated Circuits Symposium, pp.31-34, (2001)
3. Quan Xue, Kam Man Shum, and Chi Hou Chan, "Novel 1-D Microstrip PBG Cells", IEEE trans. Microwave Theory and Techniques, vol. 10, 403-405, October, (2000)
4. Quan Xue, Kam Man Shum, and Chi Hou Chan, "Novel Oscillator Incorporating a Compact Microstrip Resonant Cell", IEEE trans. Microwave Theory and Techniques, vol. 11, pp202-204, May, (2001)
5. Tsz Yin Yum, Quan Xue and Chi Hou Chan, "Amplifier Linearization Using Compact Microstrip Resonant Cell-Theory and Experiment", IEEE trans. Microwave Theory and Techniques, vol.52, pp927-934, March, (2004)
6. B. P. Yan, E. S. Yang, Y. F. Yang, X. Q. Wang, and C. C. Hsu," High Efficiency InGaP/GaAs Power Heterostructure-Emitter Bipolar Transistors with Advanced Thermal Management," IEEE Transaction on Electron Devices, vol. 50 (10), pp. 2154-2158 (2003).