Approach to on-wafer controllable trimming of SAW filters

Proceedings - IEEE Ultrasonics Symposium

Volumn 3, Issue , 2004, Pages 1888-1891

  Zhgoon, Sergei ^a   Shvetsov, Alexander ^a   Shteynberg, Oleg ^a   Bhattacharjee, Kushal ^b   Flowers, James ^b  

^a MOSCOW POWER ENGINEERING INSTITUTE   (Russian Federation)

^b Clarisay Inc   (United States)

Author keywords

On wafer; SAW filter; Trimming

Indexed keywords

ATOM MOBILITY; LEAKY WAVES; ON-WAFER; TRIMMING;

DENSITY (SPECIFIC GRAVITY); DEPOSITION; DIELECTRIC MATERIALS; LITHIUM COMPOUNDS; OXIDES; STIFFNESS; SUBSTRATES; THIN FILMS;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 21644448890     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2004.1418199     Document Type: Conference Paper

References (4)

1. S. M. Wang et al., "In-Situ Frequency Trimming of SAW Resonator Using Conventional Crystal Resonator Fine Tuning Method with Gold Thin film Addition," Proc. IEEE Ultrason. Symp. 2003, pp. 1730-1733.
2. D. P. Morgan, "A Survey of SAW Resonators," VNIISIMS Jubilee Conference, Alexandrov, June 2004, in press.
3. S.A. Zhgoon et al., "DLC films for SAW devices and novel self-aligning fabrication process," Proc.IEEE Ultrason. Symp. 2000, pp. 341-344.
4. M. Kadota, T. Yoneda, K. Fujimoto, T. Nakao, and E. Takata, "Very Small Sized Resonator Filter Using Shear Horizontal Wave on Quartz," Jpn. J. Appl. Phys. Vol 4, pp.3718-3721, May 2001.