Reliability Study of Wafer Bonding for Micro-Electro-Mechanical Systems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5343, Issue , 2004, Pages 79-86

  Almasri, Mahmoud ^a   Altemus, Bruce ^a   Gracias, Alison ^a   Clow, Larry ^a   Tokranova, Natalya ^a   Castracane, James ^a   Xu, Bai ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

3D integration; Four point Bending Test; Mechanical Test; MEMS; Packaging; Pull Test; Reliability

Indexed keywords

3D INTEGRATION; FOUR-POINT BENDING TEST; HYPERINTEGRATION; PULL TEST;

ACTUATORS; ADHESION; AROMATIC POLYMERS; BENDING (DEFORMATION); BONDING; ELECTRONICS PACKAGING; FABRICATION; INTERFACES (MATERIALS); MATERIALS SCIENCE; RELIABILITY; SILICON WAFERS; STRENGTH OF MATERIALS; SYSTEMS ANALYSIS; THERMAL EFFECTS;

MICROELECTROMECHANICAL DEVICES;

EID: 2142809836     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524934     Document Type: Conference Paper

References (10)

1. S. S. Iyer, and A. J. Auberton-Herve, Silicon Wafer Bonding Technology For VLSI and MEMSs Applications", EMIS Processing Series, No. 1. 2002.
2. G. F. Meyers, M. T. Dineen, E. O. Shaffer II, T. Stokick Jr., and J. H. Im, "Characterization Of The Surface Structural, Mechanical, and Thermal Properties Of Benzocyclobutene Dielectric Polymers Using Scanned Probe Microscopy", Macromol. Symp., Vol. 166, pp. 213-226, 2001.
3. F. Niklaus, H. Andersson, P. Enoksson, G. Stemme, "Low Temperature Full Wafer Adhesive Bonding Of Structured Wafers", Sensors and Actuators, Vol. A 92, pp. 235-241, 2001.
4. Qing Ma, "A Four Point Bending Technique For Studying Subcritical Crack Growth In Thin Films And At Interfaces", J. Mater. Res., Vol. 12, No. 3, pp. 840-845, Mar 1997.
5. J.M. Snodgrass, D. Pantelidis, M.L. Jenkins, J.C. Bravman, R.H. Dauskardt, "Subcritical Debonding Of Polymer/Silica Interfaces Under Monotonie And Cyclic Loading", Acta Materialia, Vol. 50 pp. 2395-2411, 2002
6. P. G Charalambides, J. Lund, A. G. Evans, and R. M. McMeeking, "A Test Specimen For Determining The Fracture Resistance Of Bimaterial Interfaces", J. Appl. Mech., Vol. 56, pp. 77-82, 1989.
7. T. Zhai, Y. G. Xu, J. W. Martin, A. J. Wilkinson, G. A. D Briggs, "A self-aligning four-point bend testing rig and sample geometry effect in four-point bend fatigue", International Journal of Fatigue, Vol. 21, pp 889-894, 1999.
8. J. Im, E.O. Shaffer, R. Peters, T. Rey, C. Murlick, R. L. Sammler, "Physical And Mechanical Properties Determination Of Photo-BCB-Based Thin Films", ISHM 96 Proc. pp. 168-175, 1996.
9. J. Wei, H. Xie, M. L. Nai, C. K. Wong, and L. C. Lee, "Low Temperature Wafer Anodic Bonding", J. Micromech. Microeng. Vol. 13, pp. 217-222, Dec. 2002.
10. H. Christine, S. Tsau, M. Spearing, and M. A. Schmidt, "Fabrication of Wafer-Level Thermocompression Bonds", JMEMS, Vol. 11, No. 6, pp. 641-947 Dec 2002.