Silica gel containing sulfur, nitrogen and oxygen as adsorbent centers on surface for removing copper from aqueous/ethanolic solutions

Talanta

Volumn 63, Issue 2, 2004, Pages 317-322

  Machado Jr , Ricardo S A ^a   Da Fonseca, Maria G ^a   Arakaki, Luiza N H ^a   Espinola, José G P ^a   Oliveira, Severino F ^a  

^a FEDERAL UNIVERSITY OF PARAÍBA   (Brazil)

Author keywords

Adsorption; Copper; Heavy metals; Silica gel; Thioglycolic acid

Indexed keywords

CHEMICAL OPERATIONS; COPPER; ETHANOL; NITROGEN; OXYGEN; SILANES; SULFUR; THERMAL EFFECTS;

AMINEPROPYLTRIMETHOXISILANE; THIOGLYCOLIC ACID;

SILICA GEL;

ADSORBENT; ALCOHOL; COPPER; OXYGEN; SILANE DERIVATIVE; SILICON DIOXIDE; SULFUR; THIOGLYCOLIC ACID;

ADSORPTION KINETICS; AQUEOUS SOLUTION; ARTICLE; CARBON NUCLEAR MAGNETIC RESONANCE; CHEMICAL ANALYSIS; CHEMICAL REACTION KINETICS; GEL; INFRARED SPECTROSCOPY; TEMPERATURE DEPENDENCE; THERMOGRAVIMETRY;

EID: 2142653511     PISSN: 00399140     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.talanta.2003.10.048     Document Type: Article

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